Aspiring Thermal Engineer with a research background in electronics cooling, Data Centers and Heat Transfer.
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Hi, I’m Kesava Vardhan. I’m currently a Master of Science student in Mechanical Engineering at Texas A&M University, set to graduate in December 2026.
I specialize in thermal engineering with a focus on electronics cooling and data center chip cooling, and I have published research in IJHMT. I also have hands-on experience with CFD simulation and cleanroom fabrication.
I’m currently seeking full-time thermal and CFD engineering roles.
A revolutionary in-house planar capacitive sensing approach, able to predict critical heat flux down to a temporal resolution of 2 ms.
It works by leveraging the difference in dielectric constants of water and water vapor, and uses frequency and amplitude fluctuation of capacitance as indicative guides.
I designed and 3D printed this gyroid heat exchanger with triply periodic minimal surfaces, in house.
It has a much higher surface area to volume ratio than other state of the art heat exchangers, allowing far more effective heat transfer capacity in a smaller form factor.
My custom design of a cold plate assembly in SolidWorks, consisting of a cold plate and a housing plate with built-in fluid manifolds for coolant distribution.
The design was validated for fluid flow in CFD simulation software.
I'll be in touch at the email you gave.
